PIR-Phenolic Adhesive

• Specially formulated for PIR and phenolic foam bonding
• High initial tack — immediate grab for vertical applications
• Full cure strength achieved within 24 hours
• Operating temperature after cure: -40°C to +100°C
• Bonds aluminium facings to foam core at all temperatures
• Available in cartridge (310ml) and can formats
• Solvent-based or water-based variants available
• Coverage: approximately 2–4 m² per litre
• Brush, roller, or notched trowel application