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PIR-Phenolic Adhesive
Two-component or solvent-based adhesive for bonding PIR and phenolic pre-insulated duct panels.
Accessories · ACC-010
PIR-Phenolic Adhesive
- PI-Duct Compatible
- SMACNA Standard
- Fire Tested
- Specially formulated for PIR and phenolic foam bonding
- High initial tack — immediate grab for vertical applications
- Full cure strength achieved within 24 hours
- Operating temperature after cure: -40°C to +100°C
- Bonds aluminium facings to foam core at all temperatures
- Available in cartridge (310ml) and can formats
- Solvent-based or water-based variants available
- Coverage: approximately 2–4 m² per litre
- Brush, roller, or notched trowel application
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